Importance

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Abstract

An adapter is provided for fluidly coupling a process chamber, such as a diffusion furnace or a process tube, and a fluid source, such as a torch chamber or combustion chamber, of a system for processing semiconductor material. The process tube and the torch chamber include joint segments that can engage directly together to fluidly couple the torch chamber to the process tube for introducing a fluid, such as an oxidizing gas or vapor, into the process tube. The process chamber and the torch chamber are formed of materials having different rates of thermal expansion. The adapter is configured to couple the joint segments of the torch chamber and the process tube while accommodating the differences in thermal expansion between the materials. The adapter may be formed of quartz to couple a quartz torch chamber with a silicon carbide process tube.

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First Claim