CONDUCTIVE SUBSTRATE AND FABRICATING METHOD THEREOF, AND SOLAR CELL
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United States of America Patent
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Issued Date -
Jul 4, 2013
app pub date -
Aug 6, 2012
filing date -
Dec 28, 2011
priority date (Note) -
Abandoned
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Abstract
A fabricating method of a conductive substrate including the following steps is provided. A substrate is provided. A barrier layer having a first roughened surface is formed on the substrate by an atmospheric pressure plasma process, wherein the surface roughness (Ra) of the first roughened surface formed by the atmospheric pressure plasma process is between 10 nanometers (nm) and 100 nm. A first electrode layer is formed on the first roughened surface of the barrier layer by a vacuum sputter process, wherein a second roughened surface with the surface roughness (Ra) between 10 nm and 100 nm is formed on a surface of the first electrode layer. Furthermore, a photoelectric conversion layer is formed on the second roughened surface of the first electrode layer. A second electrode layer is formed on the photoelectric conversion layer. A solar cell and a conductive substrate are also provided.
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