WATERPROOF ENDOSCOPE AND A METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Jun 27, 2013
app pub date -
Dec 22, 2011
filing date -
Dec 22, 2011
priority date (Note) -
Abandoned
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Abstract
The invention is directed to a waterproof endoscope having a wafer-level imaging module (WLM) bonded on a substrate. The endoscope also includes a holder, which has a groove formed into an inner surface of the holder. First glue is filled in the groove, and second glue is applied at a junction between the holder and the tube.
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