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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
UNIVERSITY OF SASKATCHEWAN	SASKATCHEWAN OTTAWA ONTARIO

International Classification(s)

• C12Q:MEASURING OR TESTING PROCESSES INVOLVING ENZYMES O....
• G01N:INVESTIGATING OR ANALYSING MATERIALS BY DETERMININ....

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Chirino, Manuel	Saskatoon, CA	1	0
# of filed Patents : 1 Total Citations : 0
Harding, John Clare Samuel	Humboldt, CA	2	0
# of filed Patents : 2 Total Citations : 0
Hill, Janet Elizabeth	Saskatoon, CA	5	1
# of filed Patents : 5 Total Citations : 1
Rubin, Joseph	Saskatoon, CA	3	5
# of filed Patents : 3 Total Citations : 5

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• 12 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2024/0178,182

APPARATUS AND METHOD FOR FLIP CHIP LASER BONDING

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Abstract

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A flip-chip laser bonding apparatus and method are provided in which flip-chip type semiconductor chips are bonded to a substrate using laser light. The flip-chip laser bonding apparatus and method are effective in rapidly bonding bent or flexible flip-chip type semiconductor chips to a substrate with high quality without contact defects of solder bumps.

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Description

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