Probe card and fabricating method thereof
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United States of America Patent
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Mar 8, 2016
Grant Date -
Jun 27, 2013
app pub date -
Aug 16, 2012
filing date -
Dec 27, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A probe card includes a circuit board and an integrated circuit (IC) test interface. The IC test interface includes a first probe assembly, disposed on a terminal of the circuit board, and a second probe assembly, disposed on another terminal of the circuit board, wherein the first probe assembly and the second probe assembly are separated to allow being independently assembled to, or disassembled from, the circuit board. Each of the first probe assembly and the second probe assembly includes a probe base, disposed on the circuit board; a plurality of needles, which are cantilever needles; and a covering layer, for covering the plurality of needles, and fixed on a surface of the probe base.
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