Wafer-to-wafer stack with supporting post
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United States of America Patent
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Aug 18, 2015
Grant Date -
Jun 27, 2013
app pub date -
Feb 22, 2013
filing date -
Oct 26, 2005
priority date (Note) -
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Abstract
A wafer stack includes: a first wafer having a first substrate and a first device layer having therein at least a chip; a second wafer having a second substrate disposed above the first wafer; and at least a first metal post existing in the first device layer, and arranged between the first and the second substrates, without being electrically connected to the chip.
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