SEMICONDUCTOR INTEGRATED CIRCUIT
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United States of America Patent
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Issued Date -
Jun 27, 2013
app pub date -
May 9, 2012
filing date -
Dec 21, 2011
priority date (Note) -
Abandoned
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Abstract
A semiconductor integrated circuit includes: a first conductive line coupled with a first pad for receiving a first voltage; a second conductive line coupled with a second pad for receiving a second voltage; a third conductive line arranged to be placed in a floating state; a first electrostatic discharge unit coupled between a third pad for inputting/outputting a signal and the third conductive line through a first common conductive line, wherein the first electrostatic discharge unit is configured to provide a bi-directional electrostatic discharge path between the third pad and the third conductive line according to an electrostatic discharge mode; a second electrostatic discharge unit coupled between the first conductive line and the third conductive line through a second common conductive line; and a third electrostatic discharge unit coupled between the second conductive line and the third conductive line through a third common conductive line.
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