DEVICE FOR COATING A WAFER
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United States of America Patent
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Issued Date -
Jun 27, 2013
app pub date -
Oct 19, 2010
filing date -
Oct 19, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention relates to a device for coating a surface of a wafer. The device includes a retaining system for placing the wafer on a retaining surface, a nozzle system for coating the wafer in a Z-direction, and a ring having an inside periphery that surrounds a side periphery of the wafer (2), wherein the ring can be arranged for expanding a coating surface when coating the wafer.
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