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Abstract

Provided is a resin composition which gives a cured product of a photocurable resin having excellent crack resistance even when formed into a thick film, and capable of maintaining a low coefficient of linear thermal expansion, low thermal weight loss, and a low cure shrinkage. This photosensitive silicone resin composition comprises (A) a silica particle-containing condensation reaction product and (B) a photopolymerization initiator, and is characterized in that the silica particle-containing condensation reaction product (A) is a condensation reaction product of a polysiloxane compound (a) comprising a hydrolytic condensation product of one or more silane compounds represented by the following general formula (1): R¹_n1SiX¹_4-n1 (wherein R¹, n1 and X¹ are defined in the claims) and/or the silane compound, and silica particles (b), and has a terminal structure Si—O—Y (wherein Y is defined in the claims) which satisfies the following formula (2): 0<[Si—O—SiR³₃]/([Si—O—R²]+[Si—O—SiR³₃])≦1 (wherein, R² and R³ are defined in the claims), and has a photopolymerizable functional group.

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First Claim