PLASMA-RESISTANT MEMBER AND METHOD FOR REGENERATING SAME
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United States of America Patent
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Issued Date -
Jun 20, 2013
app pub date -
Jun 30, 2011
filing date -
Aug 25, 2010
priority date (Note) -
Abandoned
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Abstract
Provided is a plasma-resistant member which can be recycled and does not easily produce particles even when exposed to plasma. Specifically provided is a plasma-resistant member which has a predetermined surface profile and is used within a plasma etching chamber. The plasma-resistant member comprises: a first SiC layer (12) that is formed by a CVD method and has a corroded surface by having been exposed to plasma etching; and a second SiC layer (13) that is laminated on the corroded surface of the first SiC layer (12) by a CVD method and has a surface that is machined so as to have the predetermined surface profile.
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