PHENYL GROUP-CONTAINING ORGANIC/INORGANIC HYBRID PREPOLYMER, HEAT RESISTANT ORGANIC/INORGANIC HYBRID MATERIAL, AND ELEMENT ENCAPSULATION STRUCTURE
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United States of America Patent
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Issued Date -
Jun 20, 2013
app pub date -
Aug 19, 2011
filing date -
Aug 20, 2010
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Abandoned
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Abstract
The object of the present invention is to provide an organic-inorganic hybrid material having heat resistance, and said object of the present invention can be attained by providing an organic-inorganic hybrid prepolymer containing a phenyl group which is prepared by the polycondensation reaction accompanying dehydration between a polydimethylsiloxane and a metal and/or semimetal alkoxide, wherein (a) phenyl group(s) is (are) partially or wholly introduced into said polydimethylsiloxane and/or said metal and/or semimetal alkoxide.
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