POLING TREATMENT METHOD, PLASMA POLING DEVICE, PIEZOELECTRIC SUBSTANCE, AND MANFACTURING METHOD THEREFOR
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United States of America Patent
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Jul 27, 2010
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Jul 27, 2010
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The plasma poling device includes: a holding electrode 4 being disposed in a poling chamber 1 and holding a substrate to be subjected to poling 2 thereon; an opposite electrode 7 being disposed in the poling chamber and being disposed opposite to the substrate to be subjected to poling held on the holding electrode; a power source 6 being electrically connected to either the holding electrode or the opposite electrode; a gas supply mechanism supplying a gas for forming plasma to a space between the opposite electrode and the holding electrode; and a control unit controlling the power source and the gas supply mechanism, wherein the control unit controls the power source and the gas supply mechanism, so as to form a plasma at a position opposite to the substrate to be subjected to poling to thereby perform poling treatment on the substrate to be subjected to poling.
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