APPARATUS FOR PLATING CYLINDER
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United States of America Patent
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Issued Date -
Jun 20, 2013
app pub date -
Sep 27, 2011
filing date -
Oct 1, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided is a plating apparatus for a cylinder, which is capable of extending service life of the entire apparatus in a technology of plating a cylinder, eliminating hardness nonuniformity of a plating layer on a cylinder surface by achieving a uniform hardness, and suppressing oxidation of a tip of chuck means. The plating apparatus for a cylinder includes: a plating bath to be filled with a plating solution; chuck means for holding a long cylinder at both ends in a longitudinal direction so as to be rotated and energized, and accommodating the long cylinder in the plating bath; and a pair of opposed insoluble electrodes which is vertically installed so as to face both side surfaces of the long cylinder in the plating bath, and is supplied with a predetermined current. The chuck means includes thermal cooling means, and the thermal cooling means includes a cooling medium and causes the cooling medium to circulate to cool a cylinder holding section of the chuck means so that heat accumulation in the long cylinder, in particular, a cylinder end portion and the cylinder holding section of the chuck means is eliminated.
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