PRINTED CIRCUIT BOARD
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United States of America Patent
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N/A
Issued Date -
Jun 20, 2013
app pub date -
Jun 21, 2012
filing date -
Dec 20, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A printed circuit board including a board, a plating layer and a solder mask layer is provided. The board has a plated through hole for inserting a termination into the board. The plated through hole passes through a surface of the board. An annual ring around the plated through hole covers the surface of the board. The plating layer is formed in the plated through hole and electrically connected to the annual ring. The solder mask layer covers the surface of the board and a portion of the outer circle of the annual ring. The plated through hole and other portion of the outer circle of the annual ring are exposed in an opening of the solder mask layer.
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