Method Of Machining Semiconductor Substrate And Apparatus For Machining Semiconductor Substrate
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United States of America Patent
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Issued Date -
Jun 13, 2013
app pub date -
Dec 12, 2012
filing date -
Dec 13, 2011
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Abandoned
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Abstract
A method of machining a semiconductor substrate using a soft polishing pad and an apparatus for machining a semiconductor substrate which has a soft polishing pad. The method includes the steps of lapping a surface of the semiconductor substrate, and polishing the lapped surface of the semiconductor substrate. The step of polishing the lapped surface of the semiconductor substrate includes polishing the lapped surface of the semiconductor substrate using slurry containing an abrasive interposed between the semiconductor substrate and a polishing pad which has a shore D hardness of 65 or less.
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