MEMS CHIP SCALE PACKAGE
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United States of America Patent
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Issued Date -
Jun 13, 2013
app pub date -
Dec 9, 2011
filing date -
Dec 9, 2011
priority date (Note) -
Abandoned
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Abstract
A flip-chip manufactured MEMS device. The device includes a substrate and a MEMS die. The substrate has a plurality of bumps, a plurality of connection points configured to electrically connect the MEMS device to another device, and a plurality of vias electrically connecting the bumps to the connections points. The MEMS die is attached to the substrate using flip-chip manufacturing techniques, but the MEMS die is not subjected to processing normally associated with creating bumps for flip-chip manufacturing.
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