BALANCED LEADFRAME PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 13, 2013
app pub date -
Dec 13, 2011
filing date -
Dec 13, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An integrated circuit package structure includes a bottom portion having a cavity, an integrated circuit attached to a top surface of the stepped cavity, a leadframe attached to the bottom portion, wire bonding for electrically coupling the integrated circuit to the leadframe, and a top portion conformally covering the integrated circuit and the bottom portion.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully