FORMATION OF ELECTRICALLY CONDUCTIVE PATTERN BY SURFACE ENERGY MODIFICATION
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United States of America Patent
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Issued Date -
Jun 13, 2013
app pub date -
Oct 29, 2010
filing date -
Nov 24, 2009
priority date (Note) -
Abandoned
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Abstract
A method for forming a conductive pattern on a substrate surface comprises altering the surface energy of the substrate surface, depositing a catalyst-doped liquid on to said substrate surface; forming a seed layer from said deposited catalyst-doped liquid, and plating the seed layer thereby forming the conductive pattern. In some embodiments, 3-D structures are placed on the substrate to delimit the size and shape of the conductive pattern. In other embodiments, the surface energy of the areas of the substrate in which conductive material is not desired (i.e., inverse pattern) is altered (e.g., lowered) to avoid having conductive liquid adhere thereto.
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