LASER ABLATION WITH EXTRACTION OF THE ABLATED MATERIAL
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United States of America Patent
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app pub date -
Jun 3, 2011
filing date -
Jun 4, 2010
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Abandoned
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Abstract
A technique comprising: using a laser beam to ablate a target surface (2) via projection lens (12) as part of a process of defining one or more elements of one or more electronic devices, wherein the ablating is performed whilst extracting material ablated from the target surface via an extraction device inlet (6) having at least a portion at a level between said target surface (2) and said projection lens (12) and at the level of a plume of ablated material above said target surface.
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