RESIST FILM FORMING APPARATUS, RESIST FILM FORMING METHOD, AND MOLD ORIGINAL PLATE PRODUCTION METHOD
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United States of America Patent
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Issued Date -
Jun 6, 2013
app pub date -
Sep 12, 2012
filing date -
Sep 30, 2011
priority date (Note) -
Abandoned
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Abstract
There is provided a resist film forming apparatus including a coating unit configured to drop, rotate, and spread a resist while rotating a substrate, a heating unit configured to heat a specimen in which the resist is coated on the substrate, a metering unit configured to measure a weight of the specimen being heated, and a control unit configured to control lamination of a plurality of resist layers on the specimen by executing a process of forming a resist layer on the substrate by performing heating in the heating unit until a predetermined amount of solvent has evaporated from a resist coated on the specimen based on the measured weight of the specimen, and repeating for a predetermined number of times a process of forming a new resist layer on a resist layer formed on the specimen by similarly controlling the coating unit and the heating unit.
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