METHOD AND SUPPORT MEMBER FOR MANUFACTURING WIRING SUBSTRATE, AND STRUCTURE MEMBER FOR WIRING SUBSTRATE
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United States of America Patent
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Issued Date -
Jun 6, 2013
app pub date -
Dec 3, 2012
filing date -
Dec 6, 2011
priority date (Note) -
Abandoned
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Abstract
A wiring substrate manufacturing method includes forming a layered configuration including a first metal layer, a peeling layer, and a second metal layer, removing an edge part of the layered configuration, so that the first metal layer is smaller than the second metal layer from a plan view, forming a support body by adhering the first metal layer to a base member and adhering the base member to a process part, the process part being formed by the removing of the edge part, forming a wiring substrate on the second metal layer, removing a part of the support body and a part of the wiring substrate that are superposed with respect to the process part from a plan view, and separating the second metal layer and the wiring substrate from the support body after the removing of the parts of the support body and the wiring substrate.
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