Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw
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United States of America Patent
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N/A
Issued Date -
Jun 6, 2013
app pub date -
Dec 2, 2011
filing date -
Dec 2, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Methods are disclosed for controlling surface profiles of wafers cut in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by changing the temperature and/or flow rate of a temperature-controlling fluid circulated in fluid communication with bearings supporting wire guides of the saw. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology.
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