Methods for packaging floor panels, as well as packed set of floor panels
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United States of America Patent
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app pub date -
Feb 1, 2013
filing date -
Mar 31, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Method for packaging floor panels, more particularly floor panels of the type that consists of rectangular oblong floor panels that are intended to form a floor covering, wherein these floor panels are industrially manufactured in at least two widths and are provided with coupling parts at least at two opposite sides, wherein floor panels of different width are provided in the same package, more particularly the same box, wherein these floor panels are provided in a box in layers, wherein in at least one of these layers at least two floor panels are placed next to each other, with their longitudinal directions substantially parallel to each other.
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