SYSTEM-IN-PACKAGE MODULE AND METHOD OF FABRICATING THE SAME
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United States of America Patent
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Issued Date -
May 30, 2013
app pub date -
Feb 7, 2012
filing date -
Nov 25, 2011
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Abandoned
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Abstract
A method of fabricating a system-in-package (SiP) module is provided, which includes: providing a substrate having a plurality of scribe lines formed thereon, forming ground pads and ground vias along the scribe lines, disposing at least one electronic component on the substrate, forming on the substrate an encapsulant for encapsulating the electronic component, cutting the substrate along the scribe lines so as to expose the ground vias, and forming a shielding layer on the encapsulant and the ground vias to thereby obtain a plurality of SiP modules. Therefore, electromagnetic radiation interferences are avoided and the design complexity and fabrication cost are reduced.
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