HOUSING OF ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

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United States of America Patent

APP PUB NO 20130133914A1
SERIAL NO

13651622

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Abstract

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A housing of electronic device includes a metallic substrate, a copper layer formed on the metallic substrate, and a heat dissipation layer formed on the copper layer. A method for manufacturing the housing is also provided.

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Patent Owner(s)

Patent OwnerAddress
FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO LTDNO 2 2ND DONGHUAN ROAD LONGHUA TOWN BAO' AN DISTRICT SHENZHEN CITY GUANGDONG PROVINCE
FOXCONN TECHNOLOGY CO LTD(236)NO 3-2 CHUNG SHAN ROAD TU-CHENG DIST NEW TAIPEI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HSU, CHIA-MING Tu-Cheng, TW 77 557
LV, YAN-SHUANG Shenzhen City, CN 3 2
SU, SHENG-HSIANG Tu-Cheng, TW 2 2

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