METHOD AND DEVICE FOR SETTING CONNECTING ELEMENTS THAT ARE SELF-DRILLING WITHOUT CHIP FORMATION
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United States of America Patent
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Issued Date -
May 30, 2013
app pub date -
Jun 9, 2011
filing date -
Jun 16, 2010
priority date (Note) -
Abandoned
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Abstract
The invention relates to a method for setting connecting elements (16), such as screws or blind rivets, which are self-drilling without chip formation, in one or more plates, wherein the plate(s) are heated by electrical energy shortly before the start of the setting process, wherein the heating is accomplished by means of an induction coil (26), which is arranged near a point on the plate(s) at which the connecting element (16) is set. The invention further relates to a device (10) for setting a connecting element (16), which is self-drilling without chip formation, in one or more plates, comprising an induction coil (26), which at least before and/or during the setting process is arranged near a point on the plate(s), at which the connecting element (16) is set.
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