MOLD AND METHOD FOR SECTIONALLY ADJUSTING COOLING EFFICIENCY OF THE MOLD
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United States of America Patent
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Issued Date -
May 23, 2013
app pub date -
Dec 28, 2011
filing date -
Nov 17, 2011
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Abstract
The present invention provides a method for sectionally controlling a cooling efficiency of a mold. The method comprises steps of: (a) configuring at least a cooling passage including a first section having a first heat-dissipating inner surface area and a second section having a second heat-dissipating inner surface area in the mold; and (b) adjusting the first and the second heat-dissipating inner surface areas unequally by using a heat-dissipating element.
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