POLYURETHANE COMPOSITION FOR CMP PADS AND METHOD OF MANUFACTURING SAME

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United States of America Patent

SERIAL NO

13746094

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Abstract

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Polyurethane composition based on a certain polyether and polyester prepolymer reaction mixture, wherein the composition is utilized in manufacturing chemical mechanical polishing/planarizing (CMP) pads. The CMP pads have low rebound and can dissipate irregular energy as well as stabilize polishing to yield improved uniformity and less dishing of the substrate.

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Patent Owner(s)

Patent OwnerAddress
PRAXAIR S T TECHNOLOGY INC441 SACKETT POINT ROAD NORTH HAVEN CT 06473

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, David Ithica, US 189 5429
Sun, Lu Ponca City, US 32 51
Zhang, Yong Milwaukee, US 773 4505

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