Apparatus and Method for Die Bonding
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United States of America Patent
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Issued Date -
May 16, 2013
app pub date -
May 1, 2012
filing date -
Nov 15, 2011
priority date (Note) -
Abandoned
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Abstract
A die bonding apparatus and a die bonding method are provided, which are capable of simultaneously bonding a plurality of dies from a first placement area onto a substrate disposed on a second placement area. The die bonding apparatus includes a die sucking device which is movably located above the first placement area and a second placement area. The die sucking device includes a plurality of nozzles. The nozzles can suck the dies disposed on the first placement area, and then simultaneously bond the dies onto the substrate.
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