THERMALLY ENHANCED PACKAGING STRUCTURE
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United States of America Patent
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Issued Date -
May 16, 2013
app pub date -
Aug 17, 2012
filing date -
Nov 11, 2011
priority date (Note) -
Abandoned
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Abstract
A thermally enhanced packaging structure includes a chip carrier; a high power chip disposed on the chip carrier; a molding compound covering the high power chip; a heat dissipating layer disposed on the molding compound, wherein the heat dissipating layer comprises a plurality of carbon nanocapsules (CNCs); and a non-fin type heat dissipating device, disposed either on the heat dissipating layer or between the molding compound and the heat dissipating layer. The molding compound can also comprise a plurality of CNCs.
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