LED SUBSTRATE, LED CHIP AND METHOD FOR MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
May 16, 2013
app pub date -
May 17, 2011
filing date -
May 29, 2010
priority date (Note) -
Abandoned
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Abstract
An LED substrate may comprise a base including a first surface and a second surface; and a conductive structure formed on at least a part of the first surface and at least a part of the second surface, the part of the conductive structure formed on the first surface electrically connected to the part of the conductive structure formed on the second surface. A method for forming an LED substrate, a method for forming an LED chip, and an LED chip manufactured therefrom may be provided as well.
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