WAFER LEVEL PACKAGING, OPTICAL DETECTION SENSOR AND METHOD OF FORMING SAME

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United States of America Patent

SERIAL NO

13670766

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Abstract

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An optical detection sensor and method of forming same. The optical detection sensor be a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object.

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Patent Owner(s)

Patent OwnerAddress
STMICROELECTRONICS PTE LTD28 ANG MO KIO INDUSTRIAL PARK 2 SINGAPORE 569508

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jin, Yonggang Singapore, SG 45 850
Lim, Wee Chin Judy Singapore, KR 13 33

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