LASER LIFT-OFF METHOD AND LASER LIFT-OFF APPARATUS
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United States of America Patent
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app pub date -
Sep 28, 2010
filing date -
Jul 20, 2010
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Abstract
A substrate is separated from a material layer formed on the substrate without generating cracks in the material layer formed on the substrate. In order to separate the material layer from the substrate at a boundary between the substrate (1) and the material layer (2), pulsed laser light (L) is applied, through the substrate (1), to a workpiece (3) having the material layer (2) formed on the substrate (1), while from moment to moment changing an irradiation region with respect to the workpiece (3), in such a manner that the adjacent irradiation regions overlap each other on the workpiece (3). The region where the pulsed laser light (L) is applied to the work (3) is set to satisfy the relationship of S/0.125, where S (mm2) is the area of the irradiation region, and L (mm) is the circumferential length of the irradiation region. Consequently, the material layer can be reliably separated from the substrate without generating cracks in the material layer formed on the substrate.
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