Wafer lens member producing method, image pickup lens producing method, image pickup module producing method, and image pickup module-installed electronic device producing method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
May 16, 2013
app pub date -
Oct 31, 2012
filing date -
Apr 30, 2010
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A wafer lens member producing method includes post-curing lens portions made of a light-curing resin formed on at least one face of a substrate so as to promote curing of the light-curing resin. The post-curing includes first post-curing and second post-curing. The first post-curing performs heating at a first post-curing temperature, which is a glass transition temperature of the light-curing resin to the glass transition temperature+100° C., for 30 minutes to two hours. The second post-curing performs heating at a second post-curing temperature, which is lower than the glass transition temperature, and lower than the first post-curing temperature by 25° C. or more, for three hours to six hours.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully