METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
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United States of America Patent
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Issued Date -
May 16, 2013
app pub date -
Oct 23, 2012
filing date -
Nov 15, 2011
priority date (Note) -
Abandoned
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Abstract
A method for manufacturing a printed circuit board includes the following steps. First, a first copper foil having first and second surfaces is provided. Second, the first copper foil is etched to remove portions of the first copper foil to convert the first copper foil into an intermediate structure having a substrate and first protrusions. Each first protrusion is exposed at the first surface. Third, a first insulation material fills into gaps between the first protrusions. Fourth, a second copper foil is laminated on the first surface. Fifth, the intermediate structure is etched from the second surface to remove portions of substrate to convert the substrate into second protrusions. Sixth, a second insulation material is infilled into gaps between the second protrusions. Seventh, a third copper foil is laminated on the second surface. Finally, the copper foils are patterned to be second and third patterns.
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