METHOD OF MANUFACTURING THIN FILM-BONDED SUBSTRATE

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United States of America Patent

APP PUB NO 20130115753A1
SERIAL NO

13668831

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of manufacturing a thin film-bonded substrate in which a high-quality gallium nitride (GaN) thin film can be transferred. The method includes implanting ions into a first

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG CORNING PRECISION MATERIALS CO LTDGYEONGSANGBUK-DO GUMI-SI 730-735

International Classification(s)

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  • 2012 Application Filing Year
  • H01L Class
  • 20465 Applications Filed
  • 18077 Patents Issued To-Date
  • 88.34 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20122013201420152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
EO, Sungwoo ChungCheongNam-Do, KR 11 8
KIM, Kyoungjun ChungCheongNam-Do, KR 15 29

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Patent Citation Ranking

  • 3 Citation Count
  • H01L Class
  • 4.91 % this patent is cited more than
  • 12 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges4074140169277539225214911984534318001 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0250500750100012501500175020002250250027503000325035003750400042504500

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