HEAT DISSIPATION DEVICE

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United States of America Patent

APP PUB NO 20130112387A1
SERIAL NO

13338252

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Abstract

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A heat dissipation device includes a first heat sink and a second heat sink connected to each other. Each of the first and second heat sinks includes a base and a plurality of fins extending from the base. The base of the first heat sink forms a rib on a lateral face thereof, and the base of the second heat sink defines a groove in a lateral face thereof. The rib is received in the groove to connect the first heat sink with the second heat sink.

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Patent Owner(s)

Patent OwnerAddress
FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO LTDNO 2 2ND DONGHUAN ROAD LONGHUA TOWN BAO' AN DISTRICT SHENZHEN CITY GUANGDONG PROVINCE
FOXCONN TECHNOLOGY CO LTD(236)NO 3-2 CHUNG SHAN ROAD TU-CHENG DIST NEW TAIPEI

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FENG, JIN-SONG Shenzhen, CN 18 235
QIN, JI-YUN Shenzhen, CN 14 84
YAN, QIANG Shenzhen, CN 54 181

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