RESIN COMPOSITION CONTAINING AROMATIC POLYISOCYANATE COMPOUND, BISPHENOL EPOXY RESIN AND IMIDAZOLE COMPOUND, AND HIGHLY THERMO-RESISTANT ISOCYANURATED CURED MATERIAL FORMED FROM THE SAME
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United States of America Patent
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Issued Date -
May 2, 2013
app pub date -
Oct 24, 2012
filing date -
Oct 28, 2011
priority date (Note) -
Abandoned
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Abstract
A liquid-state resin composition containing an aromatic polyisocyanate compound (A), a bisphenol epoxy resin (B) and an imidazole compound (C) is described, wherein the molar ratio of isocyanate groups to epoxy groups is 2 or more and preferably 2 to 15, and the amount of (C) relative to the total weight of (A), (B) and (C) is in the range of 0.2 wt % to 0.8 wt %. By stir-mixing (B) and (C), adding (A), stir-mixing again, and vacuum-degassing the resulting resin composition, a highly thermo-resistant isocyanurated cured material with a glass transition temperature of 250° C. or higher can be obtained by heat-curing the resin composition, without forming a gelated substance or bubbles.
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