METHOD FOR POLISHING SILICON WAFER, AND POLISHING SOLUTION FOR USE IN THE METHOD
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United States of America Patent
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Issued Date -
May 2, 2013
app pub date -
Jul 6, 2011
filing date -
Jul 8, 2010
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Abandoned
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Abstract
A to-be-polished surface of a silicon wafer is rough polished while supplying to a hard polishing cloth a polishing solution in which a water-soluble polymer has been added to an alkaline aqueous solution having free abrasive grains. Thus, polishing at a high polishing rate and roll-off on an outer periphery of the wafer can be satisfied simultaneously.
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