METHOD FOR MOLECULAR ADHESION BONDING AT LOW PRESSURE
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United States of America Patent
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app pub date -
Dec 18, 2012
filing date -
Aug 11, 2010
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Abstract
A three-dimensional composite structure that includes a wafer and layer of semiconductor crystalline material bonded thereto, with the layer including first and second series of microcomponents on the first and second faces respectively, with the microcomponents being in alignment such that any residual alignment offsets between the first and second series of microcomponents are less than 100 nm homogeneously over the entire surface of the structure.
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