NANO-PRECISION PHOTO/ELECTROCHEMICAL PLANARIZATION AND POLISHING METHODS AND APPARATUS THEREFOR
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United States of America Patent
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Issued Date -
May 2, 2013
app pub date -
Jun 30, 2011
filing date -
Jul 7, 2010
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Abandoned
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Abstract
The present invention provides a nano-presion photo/electrochemical planarization and polishing method and an apparatus therefor. The method comprises through electrochemical, photochemical or photoelectrochemical means, an etchant being generated on a surface of a tool electrode which has a nanometer-sized planeness; the generated etchant reacting with a scavenger contained in an working electrolyte solution, or decaying itself in the working electrolyte solution, such that a confined etchant liquid layer is generated on the tool electrode surface and having a confined thickness of nanoscale; and by a chemical reaction between the etchant contained in the confined etchant liquid layer and a surface of a workpiece, the surface of the workpiece being polished or planarized to a nanometer scaled profile precision and surface roughness, thereby, realizing the planarization and polishing in nano-precision for the workpiece.
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