METHOD FOR MANUFACTURING CIRCUIT BOARD PROVIDED WITH METAL POSTS AND CIRCUIT BOARD MANUFACTURED BY THE METHOD
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United States of America Patent
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Issued Date -
May 2, 2013
app pub date -
Oct 31, 2012
filing date -
Oct 31, 2011
priority date (Note) -
Abandoned
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Abstract
Provided is a method for manufacturing a circuit board provided with metal posts formed on at least one surface of the circuit board, the method including preparing a substrate made of a conductive material, performing a first selective etching a first surface of the substrate in regions corresponding to insulating portions of a first circuit pattern, laminating a first insulating layer over the first surface of the substrate, and performing a second etching on a second surface opposite of the first surface of the substrate, thereby forming the metal posts and the first circuit.
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