Polishing Device
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United States of America Patent
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Issued Date -
Apr 25, 2013
app pub date -
Jun 29, 2011
filing date -
Jul 2, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention describes a polishing device (100) for polishing a component (200), comprising an elongated polishing element (110), which is directed against the surface (205) of the component (200) parallel to the longitudinal axis (z) of the component (200). In this case, the polishing element (110) is formed in adjustment subsegments (110-1, 110-2, . . . 110-n) in its longitudinal extent. A housing (120) serves for receiving the polishing element (110). Arranged between a bearing surface (123 of the housing (120) and the polishing element (110) is a pressure-exerting element (130), for placing and pressing the polishing element (110) against the component (200). In this case, the pressure-exerting element (130) is formed as at least one flexible tube to which pressure can be applied.
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