SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
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United States of America Patent
Stats
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N/A
Issued Date -
N/A
app pub date -
Dec 12, 2012
filing date -
Dec 31, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention relates to a semiconductor package and a method for making the same. The method includes the steps of: (a) providing a base material; (b) forming a first metal layer on the base material, wherein the first metal layer comprises a first inductor and a first lower electrode; (c) forming a first dielectric layer and a first upper electrode on the first lower electrode, wherein the first dielectric layer is disposed between the first upper electrode and the first lower electrode, and the first upper electrode, the first dielectric layer and the first lower electrode form a first capacitor; and (d) forming a first protective layer, so as to encapsulate the first inductor and the first capacitor.
First Claim
Other Claims data not available