METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES
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United States of America Patent
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Issued Date -
Apr 25, 2013
app pub date -
Oct 19, 2011
filing date -
Oct 19, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A device for processing wafer-shaped articles comprises a closed process chamber. The closed process chamber has a side wall, a holder located within the closed process chamber adapted to receive a wafer shaped article, and a door for loading and unloading a wafer shaped article into and from the closed process chamber. The door in a first position blocks an opening in the side wall of the chamber and seals against an interior surface of the side wall of the chamber. The door is connected to an exterior of the chamber via a linkage that guides the door in a nonlinear translational movement between the first position and a second position in which the door is positioned interiorly of the chamber so as to permit loading and unloading of a wafer shaped article through the opening.
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