LED Backlight Module
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United States of America Patent
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Issued Date -
Apr 25, 2013
app pub date -
Oct 24, 2011
filing date -
Oct 24, 2011
priority date (Note) -
Abandoned
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Abstract
The present invention relates to an improved LED backlight module, which is disposed on a main frame installed in a liquid crystal display device, and comprises: a supporting body, a copper circuit layer, a plurality of LED chips, a plurality of extended thermal-conductivity layers, a light guide plate, and a bottom reflecting member. In the present invention, it mainly connects the plurality of extended thermal-conductivity layers to a plurality of the soldering points of the copper circuit layer, and attaches a majority of the extended thermal-conductivity layers to the surface of the bottom plate of the main frame through an insulating and thermal-conductivity adhesive; So that, when the LED chips emit the light, the soldering points conduct the heat produced by the LED chips to the extended thermal-conductivity layers, so as to evenly distribute the heat over the surface of the bottom plate through the extended thermal-conductivity layers.
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