HAPTIC FEEDBACK MODULE

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United States of America Patent

APP PUB NO 20130100046A1
SERIAL NO

13307626

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention is directed to a haptic feedback module, which includes a vibration plate, and at least one first actuator that is disposed along a lateral surface of the circumference of the vibration plate. The vibration plate contacts with a top plate member. When the first actuator presses the vibration plate, the vibration energy of the vibration plate is transferred to the top plate member to result in haptic feedback.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
CHIEF LAND ELECTRONIC CO LTDNO 8 WU-CHUN 5TH RD WU-KU DIST NEW TAIPEI CITY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ching, Chia-Nan Taoyuan County, TW 9 133
Chuang, Tsi-Yu Changhua County, TW 10 120

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