METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES
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United States of America Patent
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Issued Date -
Apr 25, 2013
app pub date -
Oct 20, 2011
filing date -
Oct 20, 2011
priority date (Note) -
Abandoned
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Abstract
In a method and apparatus for treating a surface of an article, an improved rinse liquid prevents build-up of static charge while avoiding damages to certain types of exposed metal surfaces. In one embodiment, a semiconductor wafer having structures including at least one of cobalt, nickel and platinum is rotated on a spin chuck, as a rinse liquid is dispensed onto a surface of the wafer. The rinse liquid is a dilute aqueous solution of a base of the formula
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