METHOD FOR POLISHING SILICON WAFER
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United States of America Patent
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Issued Date -
Apr 18, 2013
app pub date -
Jul 1, 2011
filing date -
Jul 2, 2010
priority date (Note) -
Abandoned
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Abstract
To final polish a finish-polished surface using a final polishing solution whose chief component is a weakly basic aqueous solution that does not contain abrasive grains. During the final polishing, the weakly basic aqueous solution having an alkali concentration that reduces a haze value of a final-polished surface below the haze value of the finish-polished surface of the wafer is used as the chief component of the final polishing solution.
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