Method of Fabricating Integrated Circuits
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United States of America Patent
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Issued Date -
Apr 18, 2013
app pub date -
Oct 16, 2012
filing date -
Oct 17, 2011
priority date (Note) -
Abandoned
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Abstract
A method of fabricating integrated circuits is provided in which sacrificial material is provided on a first surface of a substrate to define structural elements, integrated circuit material is provided on the sacrificial material to provide integrated circuit structures as defined by the structural elements, the sacrificial material is removed from the first surface of the substrate to provide partially fabricated integrated circuits defined by the integrated circuit structures, a carrier handle is attached to the partially fabricated integrated circuits, and the substrate is thinned from a second surface of the substrate opposite the first surface to provide the fabricated integrated circuits.
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